  |
| Home |
| Mechanics |
| Thermo-Mechanics |
| Micro- and Nano Mechanics |
| Computational Fluid Dynamics |
| Acoustics |
| Multi-Physics |
| Physics of Failure, Reliability and Durability |
| Electronics Reliability |
| URAY |
| Architectural and Building Acoustics |
| Contact |
| Job Openings |
| GPDR-Privacy |
| Udy VOF Kapellestraat 64 9220 Hamme Belgium RPR Dendermonde 474005247 BTW 0474005247 T +32 (0)52472733 M +32 (0)498624767 E info@Udy.be |
Micro- and Nano Mechanics
See below for some examples from our portfolio. Each slide represents one successfully accomplished customer project
- Chip crack
- Pressure MEMS sensor
- Power FET
- Chip sized package (CSP)
- Bond pad cracking
- Micron layer buckling delamination
- Misalignment of micro device
- Pn-junction simulation
Udy has a long-standing partnership with major semiconductor manufacturers and has gained much experience in the highly-specialized area of Micro- and Nano Mechanics by using the Finite Element Analysis. The mechanical behavior of packages e.g. may give rise to long-term electronic component failure and simulations can help to avoid it in the Engineering phase
- Both mechanical, thermal and moisture
- Both front- and back-end
- Package design
- MEMS design
- Large property database of exotic materials used in semiconductors and packages
 |
| top |
 |
| top |
 |
| top |
 |
| top |
 |
| top |
 |
| top |
 |
| top |
 |
| top |
Many more are available. Please contact us for examples with more affinity to Your needs